3D IC and 2.5D IC Packaging Market to Hit USD 150.4 Billion by 2036...

ha aggiunto una foto Networking

2026-05-05 17:09:47 -

3D IC and 2.5D IC Packaging Market to Hit USD 150.4 Billion by 2036 | Accelerated by TSV and Interposer Technology Adoption

According to the latest analysis by Future Market Insights, the global 3D IC and 2.5D IC packaging market is projected to grow from USD 63.55 billion in 2026 to USD 150.44 billion by 2036, expanding at a CAGR of 9.0%. Growth is being driven by rising demand for AI accelerators, high-bandwidth memory (HBM), and advanced semiconductor integration technologies. The market...

0 Commenti 0 condivisioni 6 Views 0 Anteprima